COB邦定膠/IC封裝膠是指裸露的集成電路芯片(IC Chip)封裝保密的一種單組份熱固化環(huán)氧樹(shù)脂膠粘劑，俗名：黑膠或COB（Chip-On-Board）邦定膠，常用的主要為兩種類型，一是邦定熱膠，一是邦定冷膠。。

   很多人在使用邦定膠前，都不太清楚，邦定熱膠是什么膠，邦定冷膠又是什么膠，是不是邦定熱膠就是需要加熱固化的，而邦定冷膠就是可以自然固化不需要加熱。其實(shí)不是，不管是邦定冷膠還是邦定熱膠，其主要類別是單組份熱固化環(huán)氧樹(shù)脂密封膠，所以，它們的固化過(guò)程都是需要放于烤箱中進(jìn)行加熱才可以固化成型；那么，為什么會(huì)有冷熱之分呢？其實(shí)，之所以這樣叫，主要是其點(diǎn)膠時(shí)間待封裝的線路板是否要先進(jìn)行預(yù)熱；

   邦定熱膠在點(diǎn)膠封膠時(shí)需要對(duì)PCB板預(yù)熱到一定的溫度，冷膠在點(diǎn)膠封膠時(shí)不需預(yù)熱電路板，室溫下即可，但熱膠在性能，固化外觀方面要好于冷膠，可根據(jù)產(chǎn)品需要自行選擇。還有通常所講的亮光膠和啞光膠的區(qū)別在于固化后的外觀是亮光還是啞光，一般邦定熱膠固化后是啞光的而邦定冷膠固化后是亮光的。還有有時(shí)會(huì)說(shuō)到高膠和低膠，它們的區(qū)別在于包封時(shí)膠的堆積高度，一般廠商可依據(jù)要求進(jìn)行調(diào)整膠水的濃度來(lái)實(shí)現(xiàn)堆積的高度。華創(chuàng)材料-專業(yè)膠粘劑研發(fā)生產(chǎn)企業(yè)，始于1999年！

   那么，該如何選用呢？通常，邦定熱膠的價(jià)格比邦定冷膠要貴很多，邦定熱膠在固化后的粘接強(qiáng)度、密封性、耐熱性、抗沖擊性等等都要優(yōu)于邦定冷膠，簡(jiǎn)單來(lái)講就是邦定熱膠固化后的各項(xiàng)性能都要比邦定冷膠高出很多，還有就是邦定熱膠一般不含溶劑，氣味較低，環(huán)保性更高，而邦定冷膠在使用過(guò)程中往往要添加一定比例的溶劑才能使用。所以，這個(gè)需根據(jù)自已產(chǎn)品的實(shí)際情況進(jìn)行選用

Cob bonding adhesive / IC packaging adhesive refers to a kind of one component heat curing epoxy resin adhesive which is used for the packaging of exposed integrated circuit chip (IC chip). The common name is black glue or cob (chip on board) bonding adhesive. There are two types of commonly used adhesives, one is bonding hot glue, the other is bonding cold glue..

Many people don't know what kind of bonding hot glue is and what kind of bonding cold glue is before using Bondin glue. Whether bondinghot glue needs to be cured by heating, while bondingcold glue can be naturally cured without heating. In fact, it is not. Whether it is bondingcold adhesive or bondinghot adhesive, its main category is one-component heat curing epoxy resin sealant, www.hcepoxy.com Their curing process needs to be placed in the oven for heating before they can be solidified; so, why is there a difference between hot and cold? In fact, the reason why it is so called is mainly whether the circuit board to be packaged should be preheated first;