環(huán)氧膠粘劑的膠粘過程是一個(gè)復(fù)雜的物理和化學(xué)共同作用的過程，包括浸潤、粘附、固化等步驟，最后生成三維交聯(lián)結(jié)構(gòu)的固化物， 把被粘物結(jié)合成一個(gè)整環(huán)氧膠粘劑與其他類型膠粘劑比較，具有以下優(yōu)點(diǎn)： 

(1) 環(huán)氧樹脂含有多種極性基團(tuán)和活性很大的環(huán)氧基，因而與金屬、玻璃、水泥、木材、塑料等多種極性材料，尤其是表面活性高的材料具有很強(qiáng)的粘接力，同時(shí)環(huán)氧固化物的內(nèi)聚強(qiáng)度也很大，所以其膠接強(qiáng)度很高。

(2) 環(huán)氧樹脂固化時(shí)基本上無低分子揮發(fā)物產(chǎn)生。膠層的體積收縮率小，約 1％一2％，是熱固性樹脂中固化收縮率最小的品種之一。加入填料后可降到 0．2％以下。環(huán)氧固化物的線脹系數(shù)也很小。因此內(nèi)應(yīng)力小，對(duì)膠接強(qiáng)度影響小。加之環(huán)氧固化物50的蠕變小，所以膠層的尺寸穩(wěn)定性好。

(3) 環(huán)氧樹脂、固化劑及改性劑的品種很多，可通過合理而巧妙的配方設(shè)計(jì)，使膠粘劑具有所需要的工藝性 ( 如快速固化、室溫固化、低溫固化、水中固化、低粘度、高粘度等 ) ，并具有所要求的使用性能 ( 如耐高溫、耐低溫、高強(qiáng)度、高柔性、耐老化、導(dǎo)電、導(dǎo)磁、導(dǎo)熱等 ) 。

(4) 與多種有機(jī)物 ( 單體、樹脂、橡膠 ) 和無機(jī)物 ( 如填料等 ) 具有很好的相容性和反應(yīng)性，易于進(jìn)行共聚、交聯(lián)、共混、填充等改性，以提高膠層的性能。華創(chuàng)材料，始于1999年專注環(huán)氧樹脂膠粘劑研發(fā)生產(chǎn)，單組份環(huán)氧樹脂膠，結(jié)構(gòu)AB膠，電子灌封膠，新材料

(5) 耐腐蝕性及介電性能好。能耐酸、堿、鹽、溶劑等大多數(shù)介質(zhì)的腐蝕。體積電阻率1013—1016Ω·cm，介電強(qiáng)度 16—35kV／mm。

(6) 通用型環(huán)氧樹脂、固化劑及添加劑的品種多、產(chǎn)地多、產(chǎn)量大，配制簡易，也可接觸壓成型，能大規(guī)模應(yīng)用。

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Epoxy adhesive glue process is a complex physical and chemical combination of the process, such as infiltration, adhesion, curing steps, the last generation of three-dimensional crosslinked structure of the condensate, combine glued objects into a whole compared with other types of adhesive, epoxy adhesive has the following advantages:

(1) epoxy resin containing a variety of polar group and active epoxy group, and with metal, glass, cement, wood, plastic and other polar materials, especially high surface active material has a strong stick relay, at the same time, the cohesion strength of epoxy curing is very big, so the bonding strength is very high.

(2) during the curing reaction of epoxy resin is basically no low molecular volatiles. Rubber volume shrinkage of small, about 1% one 2%, is one of the varieties of thermosetting resin in the curing shrinkage rate minimum. After joining the packing to be 0. Less than 2%. Epoxy curing of linear expansion coefficient is small. So the internal stress is small, little influence on bonding strength. Combined with epoxy curing 50 creep decrescent, so the size of the rubber stability is good.

Epoxy resin adhesive glue. JPG

(3) modification of epoxy resin, curing agent and agent of many varieties, can be a reasonable formula design, and clever technology needed to make the adhesive, such as fast curing, room temperature curing, low temperature curing, the water curing, low viscosity, high viscosity, etc.), and has required the use of performance, such as high temperature resistance, low temperature resistance, high strength, high flexibility, ageing resistance, conductivity, permeability, thermal conductivity, etc.).

(4) and a variety of organic matter (monomer, resin and rubber) and inorganic (such as packing, etc.) have good compatibility and reactive, easy to carry on the copolymerization, crosslinking, blending, filling modification, in order to improve the performance of the rubber. China material, began in 1999, focused on research and development of epoxy resin adhesive production, one-component epoxy resin adhesive, the structure of the AB glue, electronic potting glue, new materials

(5) the corrosion resistance and dielectric performance is good. To acid, alkali, salt, solvent etc. Most of the corrosion medium. Volume resistivity Ω 1013-1016 cm, dielectric strength 16-35 kv/mm.

(6) general-purpose epoxy resin, curing agent and the variety of additives, producing area, yield more big, easy preparation, also can contact pressure molding, to large-scale application.